FEG Components Sdn Bhd added 2 new photos in Relays - COTO Technology
Mar 28, 2020 at 10:16 pm —
2902 Series
2904 Series
FEG Components Sdn Bhd added new photo in Relays - COTO Technology
Mar 27, 2020 at 02:29 pm —
FEG Components Sdn Bhd added 2 new photos
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Axicom IM06 Series
2911 Series
FEG Components Sdn Bhd added new photo in Relays - TE Connectivity
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FEG Components Sdn Bhd added new photo in Machinery - Hoson Die Bonders
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HAD308

HAD308

HAD 308   Plane-type High Speed Die Bonder Cycle: 80ms Compatible with SMD, COB, Diodes, Flip-chip, etc.   Features   1.      Internationally leading double die-bonding, double adhesive-dispensing and double die-searching system. 2.      Linear motor is applied to drive bond head. 3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C). 4.      Crystal frame automatic correction chip structure. 5.      Programmed control constant-temperature adhesive dispensing system is also applied. 6.      Vacuum die missing testing technology is adopted. 7.      Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency. 8.      IPC will control the equipment, simplifying the equipment operation with user-friendly interfaces. 9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness. 10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.     Specifications and Parameters   1. Production Cycle 4. Die Bonder’s Swing Arm-and-hand system Production Cycle 80ms (depending on chip size and bracket) Die Bonder Swing Arm 90° Rotatable Die Bond Accuracy ± 1mil (±0.025mm) Die Bond Pressure 20g-250g (Adjustable) Die Rotation ± 1° 5. Loading Workbench 2. Chip XY Workbench Range of Stroke 300mm*75mm Chip Dimensions 5mil×5mil-80mil×80mil (0.13mm*0.13mm-2mm*2mm) XY Resolution 0.02mil (0.5μm) 6. Suitable Holder Size Max. Angle Correction ± 15° Length 145mm ~ 300mm Max. Chip Ring Size 8″/210mm (Outer Diameter) Width 40mm~ 75mm Max. Chip Area 6.5″/165mm (Expanded) 7. Facilities Needed Resolution 0.04mil  (1μm) Voltage/Frequency 220V AC±5%/50HZ Thimble Z Height Travel 80mil (2mm) Compressed Air 0.5MPa (MIN) Rated Power 950W 3. Image Recognition System Gas Consumption 5L/min Image Identification 256 grayscale 8. Volume and Weight Resolution 656 x 492 pixels Length x Width x Height 175 x 125 x 185cm Image Recognition Accuracy ± 0.025mil@50mil Observation Range Weight 1470kg read more
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