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HAD 308   Plane-type High Speed Die Bonder Cycle: 80ms Compatible with SMD, COB, Diodes, Flip-chip, etc.   Features   1.      Internationally leading double die-bonding, double adhesive-dispensing and double die-searching system. 2.      Linear motor is applied to drive bond head. 3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C). 4.      Crystal frame automatic correction chip structure. 5.      Programmed control constant-temperature adhesive dispensing system is also applied. 6.      Vacuum die missing testing technology is adopted. 7.      Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency. 8.      IPC will control the equipment, simplifying the equipment operation with user-friendly interfaces. 9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness. 10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.     Specifications and Parameters   1. Production Cycle 4. Die Bonder’s Swing Arm-and-hand system Production Cycle 80ms (depending on chip size and bracket) Die Bonder Swing Arm 90° Rotatable Die Bond Accuracy ± 1mil (±0.025mm） Die Bond Pressure 20g-250g (Adjustable) Die Rotation ± 1° 5. Loading Workbench 2. Chip XY Workbench Range of Stroke 300mm*75mm Chip Dimensions 5mil×5mil-80mil×80mil (0.13mm*0.13mm-2mm*2mm) XY Resolution 0.02mil (0.5μm) 6. Suitable Holder Size Max. Angle Correction ± 15° Length 145mm ~ 300mm Max. Chip Ring Size 8″/210mm (Outer Diameter) Width 40mm~ 75mm Max. Chip Area 6.5″/165mm (Expanded) 7. Facilities Needed Resolution 0.04mil  (1μm) Voltage/Frequency 220V AC±5%/50HZ Thimble Z Height Travel 80mil (2mm) Compressed Air 0.5MPa (MIN) Rated Power 950W 3. Image Recognition System Gas Consumption 5L/min Image Identification 256 grayscale 8. Volume and Weight Resolution 656 x 492 pixels Length x Width x Height 175 x 125 x 185cm Image Recognition Accuracy ± 0.025mil@50mil Observation Range Weight 1470kg read more

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HAD 810   Automatic Plane-type Die Bonder Cycle: 220ms Compatible with IC frames   Features 1.        Linear motors design enables the application of double adhesive-dispensing bond heads. 2.        High-precision linear driving die bond tieback, voice coil torsion loop controls die bonding pressure accurately. 3.       High-precision die-platform search system, servo motor drive die-angle correction system, equipped together with an automatic film expansion system. 4.        A separate dispensing control system is used to have a precise control over the glue-dispensing amount. 5.        Vacuum die missing testing technology is adopted. 6.        IPC will control the equipment, simplifying the equipment operation with user-friendly interfaces.   Specifications and Parameters 1.Production Cycle 4.Die Bonder’s Swing Arm-and-hand system Production Cycle 220ms (depending on chip size and bracket) Die Bonder Swing Arm 150mm linear motor reciprocate die bonding Accuracy ±0.6mil ±0.015mm Die Bond Pressure 20g-250g (Adjustable) Accuracy (Up-look inspection)  ± 1mil ±0.025mm 5.Suitable Holder Size Die Rotation  ± 1° 2.Chip XY Table Length 110mm ~ 280mm Chip Dimensions 5mil×5mil-100mil×100mil (0.13mm*0.13mm-2.54mm*2.54mm) (If utilizing glue-disk dispensing way, given the die is lesser than 12mil) Width 25mm ~ 110mm Max. Angle Correction 360° 6.Facilities Needed Max. Chip Ring Size Outer Diameter: 296mm Inner Diameter: 254mm Voltage/Frequency 220V AC±5%/50HZ Max. Chip Area 205mm (expanded) Compressed Air 0.5MPa（MIN） Resolution 0.04mil  (1μm) Rated Power 1820W Thimble Z Height Travel 80mil（2mm) Gas Consumption 5L/min   Suitable Iron ring/ wafer Standard Equipped with 10″Iron Ring and 8″Wafer Compatible with 8″Iron Ring and 6″Wafer 3.Image Recognition System Suitable Barrel Spec. Standard Equipped with 10CC (Compatible with 5CCand 3CC) Image Identification 256 grayscale 7.Volume and Weight Resolution 656 x 492 pixels Length x Width x Height 205 x 135 x 190cm Image Recognition Accuracy ±0.025mil@50mil observation range Weight 1800kg             read more