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Top Brands              Automation                          Mechanical Motion               Pneumatics Sensors              Others read more
FEG Components Sdn Bhd added 2 new photos in Kollmorgen - Servo Motors
Apr 6, 2020 at 12:11 pm —
AKMH Series
VLM Series
FEG Components Sdn Bhd added new photo in Kollmorgen - Servo Motors
Apr 6, 2020 at 10:52 am —
FEG Components Sdn Bhd added new photo in Hoson Die Bonders
Mar 30, 2020 at 11:49 am —
HAD205-P(D)CO

HAD205-P(D)CO

HAD205-D   Plane-type High-speed Die Bonder Cycle: 60ms Compatible with solder-paste printed SMD optocoupler, etc.   Features   1.      International leading double die bond and double die searching system; 2.      Linear motor is applied to drive bond head; 3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C); 4.      Automatic chip theta alignment system is applied on the Crystal frame; 5.      Vacuum die missing testing technology is adopted; 6.      Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely; 7.      IPC will control the operation of equipment, simplifying the operation of automation equipment; 8.      Sophisticated equipment will help improve your enterprises production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprises competitiveness; 9.      Precise die bond location and excellent compatibility will guarantee the back-end processing.     Specifications and Parameters   1. Production Cycle 4. Die Bonders Swing Arm-and-hand system Production Cycle 60ms (depending on chip size and bracket) Die Bonder Swing Arm 126 Rotatable Die Bond with double arms Accuracy (with die correcting feature) 1mil (0.025mm) Die Bond Pressure 20g – 250g (Adjustable) Die Rotation 1 5. Loading Workbench 2. Chip XY Workbench Range of Stroke 100mm*300mm Chip Dimensions 5mil5mil-80mil80mil (0.13mm*0.13mm-2.0mm*2.0mm) XY Resolution 0.02mil (0.5m) 6. Suitable Holder Size Max. Angle Correction 360 Length 150mm ~ 300mm Max. Chip Ring Size 6 - 7 Width 50mm ~ 100mm Max. Chip Area 4 (101mm) - 5 (127mm) 7. Facilities Needed Resolution Ratio 0.04mil  (1m) Voltage/Frequency 220V AC5%/50HZ Thimble Z Height Stroke 80mil (2mm) Compressed Air 0.5MPa (MIN) Rated Power 1000W 3. Image Recognition System Gas Consumption 5L/min Image Identification 256 grayscale 8. Volume and Weight Resolution 656 x 492 pixels Length x Width x Height 192 85 180cm Image Recognition Accuracy 0.025mil@50mil Observation Range Weight 1250kg   read more
FEG Components Sdn Bhd added new photo in Motion - Thomson
Mar 29, 2020 at 02:20 pm —
FEG Components Sdn Bhd added new photo in Relays - Panasonic
Mar 29, 2020 at 01:50 pm —
FEG Components Sdn Bhd added 2 new photos in Relays - Omron
Mar 29, 2020 at 01:48 pm —
G3VM Series
G6K Series
FEG Components Sdn Bhd added 8 new photos in Relays - Panasonic
Mar 28, 2020 at 10:28 pm —
FEG Components Sdn Bhd added 2 new photos in Relays - COTO Technology
Mar 28, 2020 at 10:16 pm —
2902 Series
2904 Series
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